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자료 필터
자료유형
발행연도
2010 ~ 2026
2010 2026
키워드
언어
전체 750건 중 161번부터 170번까지의 결과를 표시합니다.
2024
Conference
Non-destructive evaluation of polymer pipe degradation using terahertz inspection techniques
- 2024-05-30
Conference
Derivation of Representative Creep Properties for Accurate Thermal Fatigue Life Prediction in SAC305 Solder Joints through Grain and Microstructure Control
- 2024-05-30
Conference
In-situ semiconductor package chip alignment and warpage inspection technique using terahertz wave
- 2024-05-30
Conference
Measurement of the interfacial properties of thin metal film by laser spallation test
- 2024-05-30
Article
Preparation of SAC305 Solder Specimens that mimic the Microstructures of a Micro Solder Ball
- Kim, You-Gwon ;
- Kim, Heon-Su ;
- Kim, Tae-Wan ;
- Ryu, Seoung-Ung ;
- Kim, Hak-Sung ;
- 외 4명
- 2024-05
- PROCEEDINGS OF THE IEEE 74TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTC 2024
- IEEE COMPUTER SOC
Article
Measurement of the interfacial strength of thin metal film by laser spallation method for advanced wafer level package
- Ju, Young-Min ;
- Um, Hui-Jin ;
- Lee, Se-Min ;
- Kim, Dukyong ;
- Yoo, Woong-Kyoo ;
- ... Lee, Seung Hwan ;
- ... Kim, Hak-Sung ;
- 외 2명
- 2024-05
- PROCEEDINGS OF THE IEEE 74TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTC 2024
- IEEE COMPUTER SOC
Article
Advanced Bonding Process based on Intense Pulsed Light Irradiation for Solder Bump in Flip-Chip Package
- Ryu, Seong-Ung ;
- Park, Jong-Whi ;
- Ju, Young-Min ;
- Kim, Hak-Sung
- 2024-05
- PROCEEDINGS OF THE IEEE 74TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTC 2024
- IEEE COMPUTER SOC