소홍윤 프로필 사진

소홍윤

So, Hong yun

공과대학

기계공학부

Scopus ORCID

자료 필터

자료유형

발행연도

2016 ~ 2026
2016 2026

키워드

언어

전체 350건 중 1번부터 10번까지의 결과를 표시합니다.

2026
Article

Review of physics-informed machine learning in laser metal additive manufacturing: a process-lifecycle perspective on prediction, monitoring, and post-process evaluation

  • Yeo, Taegyeong ; 
  • Kim, Hyunwoo ; 
  • Lee, Munhyeong ; 
  • Kim, Junyeop ; 
  • So, Hongyun
  • 2026-12
  • Virtual and Physical Prototyping
  • Taylor and Francis Ltd.
Article

Strategic selection of multi-parametric laser settings and clinical endpoints in dermatology: an engineering-to-clinical review

  • 2026-12
  • Lasers in Medical Science
  • SPRINGER LONDON LTD
Article

Dual-salt-induced polyionic hydrogels with controlled swelling for self-healable underwater strain sensors

  • Lee, Seonghoon ; 
  • Baek, Keuntae ; 
  • Sinha, Animesh ; 
  • Kang, Hyeyun ; 
  • So, Hongyun
  • 2026-12
  • Sensors and Actuators Reports
  • ELSEVIER
Article

Decoupling PEG and chloride co-adsorption kinetics at copper/electrolyte interface during pattern-dependent electrodeposition

  • Cho, Sangmin ; 
  • Park, Jeongwoo ; 
  • Park, Sangmin ; 
  • Seol, Yulim ; 
  • Shim, Jihye ; 
  • ... Kim, Hak-Sung ; 
  • ... So, Hongyun
  • 2026-11
  • Applied Surface Science
  • Elsevier BV
Article

Materials and design strategies for interposer-based packaging: A comparative review of silicon, glass, and organic platforms

  • Kim, Yonghyun ; 
  • Lee, Hoyoon ; 
  • Park, Jeongwoo ; 
  • Cho, Sangmin ; 
  • So, Hongyun
  • 2026-09
  • Materials & Design
  • Elsevier Ltd
Article

Measuring electrical interfacial resistance of metal using modified transfer length method

  • Park, Junyoung ; 
  • Park, Sangyeun ; 
  • Kim, Hyunwoo ; 
  • Yoo, Hyeonnam ; 
  • Koo, Doheon ; 
  • ... So, Hongyun ; 
  • 외 4명
  • 2026-09
  • Measurement: Journal of the International Measurement Confederation
  • ELSEVIER SCI LTD
Article

Integrated electrochemical characterization and finite element modeling for optimizing copper filling in through-glass Vias: Kinetic parameter extraction and profile prediction

  • Kim, Young-Woo ; 
  • Baek, Jeong-Hyeon ; 
  • Lee, Se-Min ; 
  • Park, Jong-Whi ; 
  • Lee, Ho-Jin ; 
  • ... So, Hong-Yun ; 
  • ... Kim, Hak-Sung ; 
  • 외 2명
  • 2026-09
  • Journal of Electroanalytical Chemistry
  • Elsevier BV
Article

Vacuum-assisted void-free copper filling of high-aspect-ratio through-glass vias for advanced interposers

  • An, Hyemin ; 
  • Park, Sangyeun ; 
  • Kim, Yonghyun ; 
  • Lee, Hoyoon ; 
  • Kim, Gayoung ; 
  • ... So, Hongyun ; 
  • 외 2명
  • 2026-09
  • Journal of Materials Research and Technology
  • ELSEVIER
Article

Bridging passive and active cooling: A review of geometric design strategies for hybrid electronic packaging systems

  • 2026-08
  • Applied Thermal Engineering
  • Pergamon Press Ltd.
12345