@

상세 보기

김학성 프로필 사진

김학성

Kim, Hak Sung

공과대학

기계공학부

Scopus ORCID Research Gate

연구분야

  • Composite Materials, 
  • Semiconductor packaging, 
  • Terahertz non-destructive inspection, 
  • 반도체 패키징, 
  • 복합재료, 
  • 테라헤르츠 비파괴 검사
e-mail
Phone
Website

연도별 연구 활동 현황

자료 필터

자료유형

발행연도

2010 ~ 2026
2010 2026

키워드

언어

전체 750건 중 101번부터 110번까지의 결과를 표시합니다.

2025
Conference

Corrosion lifetime prediction of electro-galvanized steel based on grain size using potentiodynamic polarization test and multiphysics simulation

  • 2025-06-27
Conference

Impact of Temperature on Signal Integrity in Glass interposers

  • 2025-06-27
Conference

Research on the manufacturing process and reliability for Advanced Semiconductor Packaging

  • 2025-06-26
Conference

Optimized Curing Process for Warpage Reduction of Printed Circuit Board Based on Viscoelastic Properties Using a Dielectric Sensor

  • 2025-06-26
Conference

Fracture Strength Evaluation of Ultrathin Die Through FEM-Validated Three-Point Bending and Ball-on-Ring Tests

  • 2025-06-26
Conference

Deep learning-based real-time multi-physics prediction using finite element analysis data

  • 2025-06-26
Conference

Study on RDL reliability in advanced semiconductor packaging through copper migration analysis and current density optimization

  • 2025-06-25
Conference

탄소섬유강화 복합재의 순수 전단 시험 장치 및 미시적 파괴 지점을 고려한 멀티스케일 해석 기법 개발

  • 2025-06-25
Conference

Development of a Fatigue Life Prediction Model for SAC Solder Joints Considering Creep and Fatigue Behavior

  • 2025-06-25
Conference

Advancing Solder Joint Reliability with Bi–Ni–Pd Modified SAC Alloys: Insights into Creep Behavior, Interfacial Stability, and Joint Strength.

  • 2025-06-25

@

COPYRIGHT © All Rights Reserved.

Certain data included herein are derived from the © Web of Science of Clarivate Analytics. All rights reserved.

You may not copy or re-distribute this material in whole or in part without the prior written consent of Clarivate Analytics.