상세 보기
자료 필터
자료유형
발행연도
2010 ~ 2026
2010 2026
키워드
언어
전체 750건 중 11번부터 20번까지의 결과를 표시합니다.
2026
Conference
Enhanced reliability of Bimodal Copper Ink-filled TGVs via Step-controlled Densification in Glass Interposers
- 2026-06-25
Conference
Thermomechanical Behavior of Advanced Semiconductor Packages Substrates during Multi-step Processes
- 2026-06-25
Conference
Effects of Applied Plating Current Density on Electrochemical Reliability of RDL: In-Situ ECM Testing and Lifetime Prediction
- 2026-06-25
Conference
Comparative Study on Fabrication Quality and Reliability of Multi-Layer RDLs Fabricated by SAP and Dual-SAP
- 2026-06-25
Conference
Advancing Solder Joint Reliability with Bi–Ni–Pd Modified SAC Alloys: Insights into Creep Behavior, Interfacial Stability, and Joint Strength.
- 2026-06-25
Conference
Accuracy enhancement for airbag deployment simulations considering the strain rate and temperature- dependent mechanical properties of thermoplasticolefin and polypropylene
- 2026-06-25
Conference
Prediction of thermal bridge of building structures based on physics-informed neural networks with universal structure model
- 2026-06-25