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자료 필터
자료유형
발행연도
2010 ~ 2026
2010 2026
키워드
언어
전체 750건 중 31번부터 40번까지의 결과를 표시합니다.
2026
Conference
Milli-seconds multi flip-chip bonding process via intense pulsed light irradiation for advanced semiconductor packaging
- 2026-06-24
Article
Effects of Plating Current Density on Electrochemical Reliability of RDL: In-Situ Electrochemical Migration Testing and Time-to-Failure Prediction
- Lee, Ho-Jin ;
- Baek, Jeong-Hyeon ;
- Ahn, Hae-Su ;
- Kim, Tae-Hoon ;
- Shim, Ji-Hye ;
- ... Kim, Hak-Sung ;
- 외 2명
- 2026-06
- Proceedings - Electronic Components and Technology Conference
- Institute of Electrical and Electronics Engineers Inc.
Article
In-Situ Cure Monitoring of EMC by Fiber Bragg Grating and Dielectric Sensors with Molecular Dynamics Validation for Accurate Warpage Prediction
- An, Woo-Jin ;
- Baek, Jeong-Hyeon ;
- Yoo, Woong-Kyoo ;
- Song, Jun-Seop ;
- Shim, Ji-Hye ;
- ... Kim, Hak-Sung ;
- 외 1명
- 2026-06
- Proceedings - Electronic Components and Technology Conference
- Institute of Electrical and Electronics Engineers Inc.
Article
FEA-Integrated 3PB And BOR Testing For Fracture Strength Characterization Of Ultra-thin Dies: Effects Of Thickness, Surface Conditions, And Anisotropy
- Song, Jun-Seop ;
- Kim, Sang-Il ;
- Kim, Gyu-Won ;
- Yoo, Woong-Kyoo ;
- Yoo, Jong-Woon ;
- ... Kim, Hak-Sung ;
- 외 1명
- 2026-06
- Proceedings - Electronic Components and Technology Conference
- Institute of Electrical and Electronics Engineers Inc.
Article
Simplified Fluxless Bonding via Ultraviolet Activation: Enabling High-Reliability Fine-Pitch Interconnections
- Kim, You-Gwon ;
- Yoo, Dong-Hoon ;
- Park, Hyeong-Bin ;
- Shin, Seungchul ;
- Kang, Dongsuk ;
- ... Kim, Hak-Sung
- 2026-06
- Proceedings - Electronic Components and Technology Conference
- Institute of Electrical and Electronics Engineers Inc.
Article
Warpage Prediction of PCB in Multi-Laminating Processes Considering Cure Shrinkage and Anisotropic Visco-Elastic Properties of Prepreg Core
- Kumar, Sanjay ;
- Yoo, Woong-Kyoo ;
- Kim, Jaesung ;
- Ahn, Chae-Young ;
- Kim, Jinwoong ;
- ... Kim, Hak-Sung ;
- 외 1명
- 2026-06
- Proceedings - Electronic Components and Technology Conference
- Institute of Electrical and Electronics Engineers Inc.
Article
Process-integrated in-situ characterization and multiscale modeling of cure-dependent thermo-mechanical behavior of epoxy molding compounds for accurate warpage prediction in advanced semiconductor packaging
- Baek, Jeong-Hyeon ;
- Yoo, Woong-Kyoo ;
- An, Woo-Jin ;
- Song, Jun-Seop ;
- Oh, Gyung-Hwan ;
- ... Kim, Hak-Sung ;
- 외 1명
- 2026-06
- Materials Today Advances
- ELSEVIER
Article
Heterogeneous Integration of Compound Infrared Focal Plane Arrays (FPAs) and Silicon Read-Out Integrated Circuits (ROICs) Using Laser-Assisted Bonding at a 15µm-Pitch
- Lee, Gaeun ;
- Eom, Yong-Sung ;
- Choi, Gwang-Mun ;
- Shin, Jungho ;
- Jang, Ki-Seok ;
- ... Kim, Hak-Sung ;
- 외 9명
- 2026-06
- Proceedings - Electronic Components and Technology Conference
- Institute of Electrical and Electronics Engineers Inc.
Article
High Fidelity Reliability Prediction of SAC Solder Under Drop Impact via High Strain Rate and Temperature Dependent Properties
- Yoo, Dong-Hoon ;
- Kim, You-Gwon ;
- Bang, Jin-Young ;
- Lee, Jong-Bum ;
- Kim, Hak-Sung
- 2026-06
- Proceedings - Electronic Components and Technology Conference
- Institute of Electrical and Electronics Engineers Inc.
Article
Reliability Evaluation of Intense Pulsed Light Flip-Chip Bonding with Various Surface Finishes
- Park, Hyeong-Bin ;
- Ju, Young-Min ;
- Kim, Yun-Joong ;
- Kim, Hak-Sung
- 2026-06
- Proceedings - Electronic Components and Technology Conference
- Institute of Electrical and Electronics Engineers Inc.