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자료 필터
자료유형
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2010 ~ 2026
2010 2026
키워드
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전체 750건 중 41번부터 50번까지의 결과를 표시합니다.
2026
Article
Game-Changing Nanosolder Technology: Self-Assembling Adhesives for Sub-10 µm Ultra-Fine Interconnects
- Huh, Jin Woo ;
- Kim, Seol ;
- Kim, Tae-Wan ;
- Park, Hyeong-Bin ;
- Sim, Changhoon ;
- ... Kim, Hak-Sung ;
- 외 1명
- 2026-06
- Proceedings - Electronic Components and Technology Conference
- Institute of Electrical and Electronics Engineers Inc.
Conference
High Fidelity Reliability Prediction of SAC Solder Under Drop Impact via High Strain Rate and Temperature Dependent Properties
- 2026-05-29
Conference
Finite Element Analysis Based Design Optimization of Heat Path Block Bonding Solder Hybrid Model in Advanced Semiconductor Packages
- 2026-05-29
Conference
Game-Changing Nanosolder Technology: Self Assembling Adhesives for Sub-10 µm Ultra-Fine Interconnects
- 2026-05-29
Conference
Prediction of the warpage for large-scale semiconductor package using equivalent model considering the anisotropic thermomechanical properties based on multi-physics simulation
- 2026-05-29
Conference
Simplified Fluxless Bonding via Ultraviolet Activation: Enabling High-Reliability Fine-Pitch Interconnections
- 2026-05-29
Conference
Thermal Performance Prediction of Vapor Chamber Intergrating an RVE-Based Sintered Wick Permeability Model
- 2026-05-29
Conference
Reliability Evaluation of Intense Pulsed Light Flip Chip Bonding with Various Surface Finishes
- 2026-05-29