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자료 필터
자료유형
발행연도
2010 ~ 2026
2010 2026
키워드
언어
전체 750건 중 51번부터 60번까지의 결과를 표시합니다.
2026
Conference
Effects of Plating Current Density on Electrochemical Reliability of RDL: In-Situ Electrochemical Migration Testing and Time-to-Failure Prediction
- 2026-05-28
Conference
Heterogeneous Integration of Compound Infrared Focal Plane Arrays (FPAs) and Silicon Read-Out Integrated Circuits (ROICs) Using Laser-Assisted Bonding at a 15µm-Pitch
- 2026-05-28
Conference
In-Situ Cure Monitoring of EMC by Fiber Bragg Grating and Dielectric Sensors with Molecular Dynamics Validation for Accurate Warpage Prediction
- 2026-05-27
Conference
FEA-Integrated 3PB And BOR Testing For Fracture Strength Characterization Of Ultra-thin Dies: Effects Of Thickness, Surface Conditions, And Anisotropy
- 2026-05-27
Conference
Enhanced Reliability of Flip-Chip Solder Joints via IPL Bonding and Surface Finish Optimization
- 2026-05-27
Article
Rapid PCB warpage modeling through automated copper pattern classification and classical lamination Theory-Driven anisotropic viscoelastic homogenization
- Yoo, Woong-Kyoo ;
- Baek, Jeong-Hyeon ;
- Park, Jong-Whi ;
- Kumar, Sanjay ;
- Kim, Hak-Sung
- 2026-05
- Composites Part A: Applied Science and Manufacturing
- ELSEVIER SCI LTD
Conference
Electrical reliability evaluation of Through-Glass Via (TGV) filling using bimodal copper ink
- 2026-04-22
Conference
Corrosion lifetime prediction of electro-galvanized iron using potentiodynamic polarization and multiphysics simulation under different process and environmental conditions
- 2026-04-22