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자료 필터
자료유형
발행연도
2010 ~ 2026
2010 2026
키워드
언어
전체 750건 중 61번부터 70번까지의 결과를 표시합니다.
2026
Conference
Intergrated Optimization of Plasma Activation and Bonding Conditions for SiO2-Cu Hybrid Bonding
- 2026-04-02
Conference
Anisotropic Thermo-Viscoelastic Properties of Woven-Fabric Prepreg and Their Impact on Warpage of Ultra-Thin PCB Substrates
- 2026-04-02
Article
Non-destructive evaluation of thermally induced structural transformation in PET using terahertz time-domain spectroscopy
- Kim, Tae-Wan ;
- Kim, Sang-Il ;
- Kim, Heon-Su ;
- Moon, Chang-Jin ;
- Kim, Hak-Sung
- 2026-03
- MATERIALS TODAY ADVANCES
- ELSEVIER
Article
Development of the modified V-notched rail shear test for carbon fiber reinforced composites with multi-scale simulation method considering microscopic failure points
- Kim, Gyu-Won ;
- Rho, Hyun-Ji ;
- Kim, Young-Woo ;
- Song, Jun-Seop ;
- Kim, Woe Tae ;
- ... Kim, Hak-Sung ;
- 외 2명
- 2026-03
- Composites Part A: Applied Science and Manufacturing
- ELSEVIER SCI LTD
Article
Microstructured anisotropic PDMS sheet for damage-free electrical testing of semiconductor packages
- Seol, Yulim ;
- Jeong, Jaeheon ;
- Shim, Ji-Hye ;
- Kim, Hak-Sung ;
- So, Hongyun
- 2026-03
- Sensors and Actuators, A: Physical
- Elsevier BV
Article
In-situ inspection of stealth laser diced internal crack lines in silicon wafer using cepstrum signal processing with terahertz electromagnetic waves
- Kim, Sang-Il ;
- Kim, Heon-Su ;
- Kim, Tae-Wan ;
- Lim, Jinsang ;
- Han, Dong-Su ;
- ... Kim, Hak Sung ;
- 외 1명
- 2026-02
- Measurement: Journal of the International Measurement Confederation
- Elsevier BV
Article
다중 물리 시뮬레이션 기반 이방성 열-기계적 특성을 고려한 등가 모델링 활용 대면적 반도체 패키지의 워피지 예측
- 유웅규 ;
- 백정현 ;
- 박종휘 ;
- 김학성
- 2026-02
- Composites Research
- KOREAN SOC COMPOSITE MATERIALS
Article
A critical review of the past, present, and future of 3D printing for continuous and short fiber composites
- Kumar, Sanjay ;
- Yoo, Dong-Hoon ;
- Song, Jun-Seop ;
- Kim, Hak-Sung
- 2026-01
- Composite Structures
- ELSEVIER SCI LTD
Article
In-situ non-contact monitoring of photoresist thickness and degree of cure using terahertz time-domain spectroscopy
- Kim, Sang-il ;
- Kim, Hak Sung
- 2026-01
- NDT and E International
- ELSEVIER SCI LTD
2025