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자료 필터
자료유형
발행연도
2010 ~ 2026
2010 2026
키워드
언어
전체 750건 중 81번부터 90번까지의 결과를 표시합니다.
2025
Conference
Effects of EMC Degradation on Viscoelastic Properties and Reliability in Power Semiconductor Packages
- 2025-11-12
Conference
Advanced Flip-chip Bonding Process via Intense Pulsed Light Irradiation: From Single-Chip to Multi-Chip Stacking Applications
- 2025-11-11
Conference
Drop impact reliability of SAC Solder: Insights from high strain-rate and elevated-temperature behavior
- 2025-11-07
Conference
Thermal Fatigue Characterization of SAC305 Solder Joints via a DNP-Oriented Modified Test Vehicle
- 2025-11-07
Conference
Prediction of the warpage for large-scale semiconductor package using equivalent model considering the anisotropic thermomechanical properties based on multi-physics simulation
- 2025-11-07
Article
Optimization and field evaluation of a detachable thermal insulation fabric for rail temperature mitigation
- Park, Juyeop ;
- Kang, Donghoon ;
- Kim, Hak-Sung
- 2025-11
- Construction and Building Materials
- ELSEVIER SCI LTD
Article
Effect of electroplating current density and post-annealing on the warpage and reliability of redistribution layer for advanced semiconductor package
- Kim, Taek-Hyeon ;
- Baek, Jeong-Hyeon ;
- Kim, Sang-Il ;
- Kim, Tae-Hoon ;
- Shim, Ji-Hye ;
- ... Kim, Hak-Sung
- 2025-11
- Materials & Design
- ELSEVIER SCI LTD
Article
Determination of Fatigue Model Constants for Bi-Based SAC305 Hybrid Solder Joint
- Jang, Yongrae ;
- Kim, You-Gwon ;
- Kim, Hak-Sung ;
- Kim, Do-Hyung ;
- Jang, Dong-Min ;
- 외 3명
- 2025-10
- IEEE Transactions on Components, Packaging and Manufacturing Technology
- IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
Article
Advanced Optical Integration Processes for Photonic-Integrated Circuit Packaging
- Baek, Keuntae ;
- Kim, Minhyeok ;
- Kim, Hak-Sung ;
- Ahn, Jinho ;
- So, Hongyun
- 2025-10
- ADVANCED MATERIALS TECHNOLOGIES
- WILEY
Article
Integrated design and validation of 3D radiant heater for electric vehicles: Thermo-Electrical finite element analysis considering strain-dependent resistance in thermo-forming
- Baek, Jeong-Hyeon ;
- Park, Tae-In ;
- Kim, Yoon-Jin ;
- Park, Ji-Sun ;
- Kim, Hak-Sung
- 2025-10
- Materials & Design
- ELSEVIER SCI LTD